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- Review: Digital value creation in production – rethought!
- Workshop: 'Technology 4 Resilience – Europe quo vadis?'
- Review of the ESBS Spring Conference 2024
- Young Academics 2025
- ESBS-Austria @ Chips JU Information Day Italy 2024
- Successful Austrian IPCEI Day
- ESBS@IMAGINE24
- ECS SRIA 2025 - Draft version available!
- ECS SRIA 2024
- Chips JU - new Excutive Director
- Silicon Alps Peak Performer
- ESBS-Austria @IMAGINE23
- Chips JU as integral part of European Chips Act
- ESBS-Austria Conference: "Energy efficiency enabled by ESBS"
- ESBS-Austria@IMAGINE22 - Twin Transformation
- Young Academics - Winner's Awards 2022
- KDT and European Chips Act, 28 April 2022, Villach
- Growth, innovation and partnerships
- KDT Information Day Italy 2023
- Lab2Fab Semiconductor - Technology offensive for the semiconductor industry
- ECS SRIA 2023 - ONLINE VERSION AVAILABE!
- UltimateGaN – Enabler for green applications
- Successful Austrian IPCEI Day in Leoben
- ESBS-Austria Technical Position Paper 2023
- ESBS-Austria Conference: Sustainability and ESBS
- Members
- AIT Austrian Institute of Technology GmbH
- Alpen-Adria Universität Klagenfurt - Department of Smart Systems Technologies
- ams-OSRAM AG
- Austrian Association for the Electrics and Electronics Industry (FEEI)
- AT&S Austria Technologie & Systemtechnik AG
- AVL List GmbH
- BMK Federal Ministry for Climate Action, Environment, Energy, Mobility, Innovation and Technology
- Besi Austria GmbH
- CISC Semiconductor GmbH
- Department for Integrated Sensor Systems (DISS)
- TDK Electronics GmbH & Co OG
- EV Group Europe & Asia / Pacific GmbH
- FH Joanneum – Institute Electronic Engineering
- Fronius International GmbH
- Infineon Technologies Austria AG
- Infineon Technologies Linz GmbH & Co KG
- Intel Austria GmbH
- Johannes Kepler University Linz
- Joanneum Research Forschungsgesellschaft mbH
- Kompetenzzentrum – Das Virtuelle Fahrzeug Forschungsgesellschaft mbH
- LAM Research AG
- Linz Center of Mechatronics GmbH
- Materials Center Leoben Forschungs GmbH
- Mission Embedded GmbH
- NXP Semiconductors Austria GmbH & Co KG
- Plansee SE
- Research Studio Austria Forschungsgesellschaft mbH
- Salzburg Research ForschungsgesellschaftmbH
- SBA Research gGmbH
- Siemens AG Österreich
- Silicon Austria Labs GmbH (SAL)
- Software Competence Center Hagenberg GmbH
- Hitachi Rail GTS Austria GmbH
- Terma Technologies GmbH
- TTTech Computertechnik AG
- TU Wien - Institute for Mechanics and Mechatronics (MEC)
- TU Wien - Automation and Control Institute (ACIN)
- TU Wien - Institute of Electrodynamics, Microwave and Circuit (EMCE)
- TU Wien - Institute of Computer Engineering
- TU Graz - Institute of Microwave and Photonic Engineering
- TU Graz - Institute of Electrical Measurement and Measurement Signal Processing
- VRVis GmbH
- Events
- 2025 PEDC-Pan-European Design Conference
- Smart Systems Integration (SSI)
- Nanotech France 2025
- ECS SRIA advisory Stakeholder Forum
- ICOS Workshop/ESSERC 2024 Conference
- ESBS-Austria event: Digital value creation in production – rethought!
- ESBS-Austria Workshop at Technology Talks Austria 2024 - Triple Transition
- Competence Centers Applicants - Networking
- The Autonomous
- EBSCON 2024
- EFECS 2024 - Register now!
- FEDERATE SW Defined Vehicle Ecosystem Networking Event
- Eclipse-SDV Open Code Experience 2024 (OCX24)
- Austrian IPCEI Day
- ESBS-Austria Conference - The Chips JU
- ECS Brokerage Event 2024
- Chips JU Information Day
- Austrian IPCEI Days
- Smart Systems Integration (SSI)
- EPoSS Annual Forum 2024
- IMAGINE24
- Nanotech France 2024
- Chips JU Launch Event
- Call 'Digital Technologies 2023' - Launch event
- Advanced Packaging and 3D Heterogeneous Integration for RF/mmWave Applications
- AI-assisted Methods and Tools for ECS Engineering Efficiency
- Chips JU as integral part of European Chips Act
- Silicon Austria Labs Symposium on 6G
- EBSCON 2023
- The Autonomous
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